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FM INDUSTRIES ADVANCED TECHNOLOGIES® are focused on providing prototype and production manufacturing / services and technical solutions for over 30 years. We are focused on efficiency and quality through high-speed machining, cellular manufacturing, critical process control and supplier management. FMI® expertise is extensive and ranges from Multi-Pallet Flexible Manufacturing Systems (FMS), horizontal milling, vertical milling, turning, 5-axis machining, process automation, including supporting processes such as welding, brazing, heat treating, anodization, custom coatings, critical cleaning, and much more. We use the most advanced, state-of-the-art equipment and software. To compete in the highly competitive global markets, we are focused on effective process design and control to provide custom products and services that are consistently high in quality, on time and at prices that are competitive.

Semiconductor tool manufactures can count on Semiconductor Grade Diffusion Bonding, SGDB™, products and services from FM INDUSTRIES ADVANCED TECHNOLOGIES®.

FMI® provides various types of SGDB ™ services to make ready for use semiconductor chamber components. FMI® has developed proprietary and patented methods using precision machining, critical cleaning and environmentally controlled high vacuum furnaces for diffusion bonding. These components may go thru subsequent machining, heat treatments, anodization, coatings and critical cleaning to provide chamber ready components.

The SGDB™ chamber ready components have low stress bonded interfaces by solid state diffusion. Bonding is activated through precisely controlled pressures on faying surfaces with flatness < 5 µm, surface roughness < 0.8 µm Ra or specific textures, temperatures held below melting points and time exposures with complex thermal cycles in high vacuum chambers that are free of contaminants of concern to semiconductor tools and meet Helium tightness requirements better that 1E-9 sccs. Bond strength great than 85% of parent materials are obtained. Such distortion free diffusion bonded components may have various type of films or interface materials or FMI® coatings when they are made ready for use in semiconductor process chambers to meet stringent particles and purity requirements.

SGDB™ is integrated into FMI® manufacturing services for chamber components like shower heads, cooling platens and electrostatic chucks to achieve distortion free components that do not generate particles in service and increase process yields.

Semiconductor tools require precision joined components that can only be accomplished by FMI® provided Semiconductor Grade Electron Beam, SGEBW™ technologies and integrated services.

FM INDUSTRIES ADVANCED TECHNOLOGIES® provides comprehensive manufacturing and various surface treatments for ready to install components in semiconductor process chambers. FMI® has developed patented and proprietary methods utilizing precision machining, critical cleaning and environmentally controlled high vacuum environments free from contaminations concerns to semiconductor tools. The SGEBW™ chamber components by FMI ®may have combination of bonded interfaces by e-beam welding, friction stir welding or Semiconductor Grade Diffusion Bonding, SGDB™. Such distortion free components may have various type of films or interface materials or FMI® coatings when they are made ready for use in semiconductor tools to meet stringent particles and purity requirements.

SGEBW™ require contamination free high vacuum chamber, electron beam with frequency and magnetic field configuration control to provide chamber components with helium tight joints, < 1E-9 sccs and very small heat effected zones and precision geometries to maintain flatness less than 5 µm.

SGEBW™ technologies offered by FMI® provide enhanced features like complex cooling gas or fluid or instrument passages/manifolds for distortion free, demagnetized components with stacked structures and hermetically sealed bond lines with low porosity thru the weld thickness to increase components life during extended plasma exposures in various semiconductor tools.

FM INDUSTRIES ADVANCED TECHNOLOGIES® provide our customers with a range of products and services for manufacturing including electro-mechanical assemblies, complex prototype components, hybrid electrostatic chucks with interdigitated electrode design, load locks, chambers, heating and cooling platens with dielectric protections, showerheads and more. We have expertise working with a wide variety of custom materials and coatings. Customer orders, manufacturing scheduling, product movement, inventory and material orders are controlled and tracked using a fully integrated ERP system.

Before shipping products to our customers, they are subjected to rigorous testing and inspection to assure product quality. Please contact FMI® with any questions and see below for details.

FMI® Capabilities

General Capabilities
  • Research & Development
  • Vertically Integrated
  • Design for Manufacturability
  • Concurrent Engineering
Prototype Method
  • 5 Axis Machining
  • SGDB™, Semiconductor Grade Diffusion Bonding
  • SGEBW™, Semiconductor Grade Electron Beam Welding
  • Welding Brazing
  • Assemblies
Prototyped Product
  • Semiconductor Processing Equipment
  • Complex Components
  • Aluminum (Forged, Cast)
  • Stainless Steel
  • Inconel
  • Kovar
  • Forged Aluminum
  • Cast Aluminum Titanium
  • High Performance Plastics
  • PEEK
  • Ultem
  • Rexolite
  • Teflon
Additional Services Provided
  • Bill of Materials
  • Management
  • Subset Supplier Management
  • Weld Integrity
  • Helium Leak Check
  • Hydrostatic Test
Maximum Length
  • 45 in
Maximum Width
  • 45 in
Maximum Height
  • 45 in
Tolerance (+/-)
  • .0002 in
Production Volume
  • Prototype to Short Run
Lead Time
  • Rapid Prototype Development

Additional Information

Industry Focus
  • Semiconductor
  • Solar
Industry Standards
  • ISO 9001:2015
  • ISO 14000
  • Six Sigma Certification – Green Belt
  • Lights Out Manufacturing
  • Lean Manufacturing
File Formats
  • AutoCAD Inventor (3D)
  • MasterCAM