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FM INDUSTRIES®, Inc. specializes in assembly, integration, and testing of tool subsystems for semiconductor wafer processing equipment in class 10,000 and 1,000 cleanrooms. FMI’s testing capabilities include helium leak, rate of rise, pressure decay, hydrostatic pressure, thermal conductivity, stress strain, and functional testing. All procedures are defined and documented via work instructions to ensure consistent product configuration and performance. Additionally, FMI offers a wide range of inspection capabilities, including CMM dimensional, digital microscope, and automated optical inspection. Rapid prototyping and customer collaboration facilitate an efficient design iteration process that supports critical customer “time to market” requirements. In-house capability to design and fabricate tooling and fixtures further enhances our ability to respond quickly to customer needs.

FM INDUSTRIES®, Inc. also utilizes a dedicated, humidity controlled, class 10,000 cleanroom for Autoclave bonding. Typical applications include bonding of electrostatic chucks and showerheads using compliant and thermally conductive sheet adhesives. The resulting bond layer provides stable thermal transfer between components, compliance to address CTE mismatch, resistance to chamber chemistry, and high temperature performance. Supporting equipment includes fully automated vacuum prebake ovens for out-gassing adhesives, cutting plotters for accurate material geometry, and clean room convection ovens for post-bond bakeout. Bonded parts are thoroughly inspected for critical alignment, bond integrity, and performance requirements. Onsite test chambers and fixtures are utilized to ensure conformance to product and performance specifications.

Please see the table below for additional details or contact us us directly.

FMI® Assembly

General Capabilities
  • Electro-Mechanical Assembly
  • Integration
  • Inspection
  • Potting
  • Testing
  • Packaging
  • Class 10,000 and 1,000 Cleanrooms
  • Humidity Controlled
  • Class 1,000 Laminar Flow Benches
  • Helium Leak Detectors
  • Degas Chambers
  • Digital Microscopes
  • Custom Test Fixtures
  • Cleanroom Vacuum Ovens
  • Cleanroom Convection Ovens
  • Custom Assembly Fixtures
  • Cranes, Hoists, and Lifts
Assembled Products
  • Electro-Mechanical Assemblies
  • Chamber Modules
  • Electrostatic Chucks (ESC’s)
  • Chamber Lids
  • Gas Distribution Plates (GDP’s)
  • Precision Ceramics
  • Cathodes
  • Complex Machined Parts
  • Showerheads
  • Dome Temperature Control Units
  • Semiconductor Process Chamber Subsystems
  • End Effector Assemblies
  • Forelines
  • Valves
  • Pump Stacks
  • Pneumatics
  • Power Supplies
  • Wire Harnesses
  • Lift Mechanisms
  • Aluminum
  • Ceramic
  • Molybdenum
  • Steel
  • High Performance Plastics
  • Assorted Specialty Materials
  • ESC Performance Testing
  • Helium Leak Checking
  • Hydrostatic Pressure Testing
  • Rate of Rise Testing
  • Flow Testing
  • Stress Strain Testing
  • Pressure Decay Testing
  • Thermal Conductivity Testing
  • Functional Testing
  • CMM Dimensional Inspection
  • Digital Microscope Inspection
  • Automated Optical Inspection
  • Work Instructions
  • Process Routings
  • C of C’s
  • Check Sheets
  • TQC’s
  • ERP Configuration Control
Industry and Customer Standards
  • ISO 9001, 14001, 45001 Certified
  • Customer Drawings and Specifications
  • Build to Print
  • Six Sigma Certifications – Green and Black Belt
  • Lights Out Manufacturing
  • Lean Manufacturing
  • JIT Manufacturing
  • Single Piece R&D to Full Production Quantities
  • Customer Specifications / Mil-Std / Custom Designed
Delivery & Turnaround Time
  • Rapid Prototyping Services Available

FMI® Bonding

General Capabilities
  • Autoclave Bonding
  • Epoxy Application
  • Vacuum, Pressure, and Temperature Control
  • Fixture Design and Fabrication
  • Bond Line Integrity Evaluation
  • Pressure Sensitive Adhesives
  • Potting Material Application
  • Automated Cure Profiles
  • Vacuum Degas
  • Class 10,000 Cleanroom
  • Taricco 3′ x 5′ Autoclaves
  • Cleanroom Vacuum Ovens
  • Cutting Plotter
  • Thermal Equipment 3′ x 7′ Autoclave
  • Cleanroom Convection Ovens
  • Thermal Imager
Autoclave Size Envelope
  • Internal Vessel Size: 30″ Dia x 72″ Long
Autoclave Maximum Pressure
  • 200 PSI
Autoclave Maximum Temperature
  • 250 F
  • Electrostatic Chucks
  • Showerheads
Bonding Materials
  • Pressure Sensitive Adhesives
  • Thermally Conductive Adhesives
  • RTV’s
  • Thermal Gaskets
  • Epoxies
  • Primers
  • Dielectric Tough Gels
Component Materials
  • Aluminum
  • Adhesives
  • Ceramics
  • Plastics
  • Helium Leak Testing
  • Current Leak Testing
  • Thermal Imaging
  • CSAM
  • Flow Testing
  • Bond Line Leak Check
  • CMM Dimensional Inspection
  • Digital Microscope Inspection
  • Automated Optical Inspection